The test socket can be fully customized according to customer needs, such as in terms of alloy materials, probe structure, and electroplating. It can be manufactured according to different testing needs. Therefore, it can be used for a wide range of tests, such as high frequency, high speed, and wide temperature range. Currently, the minimum pitch  for Package testing is 0.3mm.

●BGA/LGA Pitch：0.3 ~1.27mm

●DFN/QFN Pitch ：0.4/0.5mm

●QFP Pitch：0.35/0.4/0.5mm