1.TDP大功率顶部为散热片及散热风扇，且风扇转速可由“PWM”信号调节，转速初步推荐值为1500-9000PPM (根据仿真情况灵活调节散热转速区间）。    2.压块采用导热性能良好的黄铜材料，有利于大功率芯片散热降温。

50 ohm matched probe contact
Spacing: > 0.3mm

1. Meet the requirements of simultaneous test of baseband chip superimposed antenna.
2. Meet the test requirements of 5g communication or microwave radar.

1. It can be used for automatic machine test.
2. The test frequency can reach above 70ghz.